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4.7: References

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    41112
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    [1] R. Hackborn, “An automatic network analyzer system,” Microwave Journal, pp. 45–52, May 1968.

    [2] http://www.ggb.com.

    [3] G. Engen and C. Hoer, “Thru-reflect-line: An improved technique for calibrating the dual six-port automatic network analyzer,” IEEE Trans. on Microwave Theory and Techniques, vol. 27, no. 12, pp. 987–993, Dec. 1979.

    [4] S. Goldberg, M. Steer, P. Franzon, and J. Kasten, “Experimental electrical characterization of interconnects and discontinuities in highspeed digital systems,” IEEE Trans. on Components, Hybrids, and Manufacturing Technology, vol. 14, no. 4, pp. 761–765, Dec. 1991.

    [5] M. Steer, S. Goldberg, G. Rinne, P. Franzon, I. Turlik, and J. Kasten, “Introducing the through-line deembedding procedure,” in 1992 IEEE MTT-S Int. Microwave Symp. Dig.,, Jun. 1992, pp. 1455–1458.

    [6] J. Hunton, “Analysis of microwave measurement techniques by means of signal flow graphs,” IRE Trans. on Microwave Theory and Techniques, vol. 8, no. 2, pp. 206–212, Mar. 1960.

    [7] J. Fitzpatrick, “Error models for systems measurement,” Microwave Journal, pp. 63–66, may 1978.

    [8] A. A. M. Saleh, “Explicit formulas for error correction in microwave measuring sets with switching-dependent port mismatches,” IEEE Trans. on Instrumentation and Measurement, vol. 28, no. 1, pp. 67–71, Mar. 1979.

    [9] H. Shurmer, “Calibration procedure for computer-corrected s parameter characterisation of devices mounted in microstrip,” Electronics Letters, vol. 9, no. 14, pp. 323–324, 12 1973.

    [10] De-embedding and Embedding S-paramater Networks Using a Vector Network Analyzer, May 2004, agilent Application Note 1363–1.

    [11] J. Butler, D. Rytting, M. Iskander, R. Pollard, and M. Vanden Bossche, “16-term error model and calibration procedure for on-wafer network analysis measurements,” IEEE Trans. on Microwave Theory and Techniques, vol. 39, no. 12, pp. 2211–2217, Dec. 1991.

    [12] B. Bianco, M. Parodi, S. Ridella, and F. F. Selvaggi, “Launcher and microstrip characterization,” IEEE Trans. on Instrumentation and Measurement, vol. 25, no. 4, pp. 320–323, Dec. 1976.

    [13] C. Hoer, “Choosing line lengths for calibrating network analyzers,” IEEE Trans. on Microwave Theory and Techniques, vol. 31, no. 1, pp. 76–78, Jan. 1983.

    [14] C. A. Hoer, “Some questions and answers concerning air lines as impedance standards,” in 29th ARFTG Conf. Digest-Spring, vol. 11, Jun. 1987, pp. 161–173.

    [15] P. Buff, “Characterization of propagation on wires over lossy earth,” Ph.D. dissertation, North Carolina State University, 2006.

    [16] P. Buff, J. Nath, and M. Steer, “Origin of the half-wavelength errors in microwave measurements using through-line calibrations,” IEEE Trans. on Instrumentation and Measurement, vol. 56, no. 5, pp. 1610–1615, Oct. 2007.

    [17] R. Marks, “A multiline method of network analyzer calibration,” IEEE Trans. on Microwave Theory and Techniques, vol. 39, no. 7, pp. 1205–1215, Jul. 1991.

    [18] D. Williams, “De-embedding and unterminating microwave fixtures with nonlinear least squares,” IEEE Trans. on Microwave Theory and Techniques, vol. 38, no. 6, pp. 787–791, Jun. 1990.

    [19] N. R. Franzen and R. A. Speciale, “A new procedure for system calibration and error removal in automated s-parameter measurements,” in 5th European Microwave Conf., Sep. 1975, pp. 69–73.

    [20] J. Benet, “The design and calibration of a universal MMIC test fixture,” in Microwave and Millimeter-Wave Monolithic Circuits, vol. 82, no. 1, Jun. 1982, pp. 36–41.

    [21] S. R. Pennock, C. M. D. Rycroft, P. R. Shepherd, and T. Rozzi, “Transition characterisation for de-embedding purposes,” in 17th European Microwave Conf., Sep. 1987, pp. 355– 360.

    [22] W. Eisenstadt and Y. Eo, “S-parameter-based ic interconnect transmission line characterization,” IEEE Trans. on Components, Hybrids, and Manufacturing Technology, vol. 15, no. 4, pp. 483–490, Aug. 1992.

    [23] Yungseon Eo, W. Eisenstadt, and Jongin Shim, “S-parameter-measurement-based high-speed signal transient characterization of vlsi interconnects on sio2-si substrate,” IEEE Trans. on Advanced Packaging, vol. 23, no. 3, pp. 470–479, Aug. 2000.

    [24] Yungseon Eo and W. Eisenstadt, “Highspeed vlsi interconnect modeling based on s-parameter measurements,” IEEE Trans. on Components, Hybrids, and Manufacturing Technology, vol. 16, no. 5, pp. 555–562, Aug. 1993.

    [25] R. Amaudov and R. Borisov, “S-parametersbased extraction of effective dielectric constant in transmission lines on multilayer substrates,” in Telecommunications Forum (TELFOR), 2011 19th, Nov. 2011, pp. 900–903.


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