Skip to main content
Engineering LibreTexts

14.8: Questions

  • Page ID
    36489
  • Quick questions

    You should be able to answer these questions without too much difficulty after studying this TLP. If not, then you should go through it again!

    Why are substrates often rotated during the deposition process?

    a To increase the speed of deposition.
    b To allow compounds to be deposited.
    c To help give a uniform thickness.
    d To help cool the substrate surface.
    Answer

    C

    What is an advantage of using electron beam evaporation over resistive heating evaporation?

    a Lower contamination levels from the heating vessel.
    b Lower cost.
    c Increased speed of deposition.
    d Compounds can be evaporated.
    Answer

    A

    Why is argon often used as the gas in the sputtering set up?

    a It is reactive.
    b It is inert.
    c It is heavy.
    d It is easily ionised.
    Answer

    B

    What effect does changing the angle of deposition have on the film?

    a Makes the coating less uniform.
    b Makes the coating more uniform.
    c ‘Tilts’ the shadowed regions and columns to a different angle.
    d No effect.
    Answer
    C

    What conditions are most likely to lead to Layer Growth?

    a Film atoms are more strongly bound to each other than to the substrate.
    b Film atoms are more strongly bound to the substrate than to each other.
    c Low atomic energy (<5eV).
    d High misfit strain between the substrate and the film
    Answer

    B

    Open-ended questions

    The following questions are not provided with answers, but intended to provide food for thought and points for further discussion with other students and teachers.

    1. Explain how Pulsed Laser Deposition allows coating of precise compositions of alloys and compounds.
    • Was this article helpful?