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5.2: The Directive

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    Prohibited substances

    Article 4 Prevention paragraph 1 states: "Member States shall ensure that, from 1 July 2006, new electrical and electronic equipment put on the market does not contain lead, mercury, cadmium, hexavalent chromium, polybrominated biphenyls (PBB) or polybrominated diphenyl ethers (PBDE). National measures restricting or prohibiting the use of these substances in electrical and electronic equipment which were adopted in line with Community legislation before the adoption of this Directive may be maintained until 1 July 2006."[1]

    Operationally, this did not mean a total eradication of the substances, but rather fitting under a certain threshold maximum concentration. These concentrations were later published in the RoHS Directive that followed the initial one.[2]

    Table \(\PageIndex{1}\): RoHS Substance Concentration Limits
    Substance Maximum Concentration (percent) Comments
    Lead (element Pb) 0.1% (1,000 parts per million PPM) Used in solders, components, printed circuit boards
    Hexavalent Chromium (Cr6) 0.1% (1,000 parts per million PPM) Used in dyes, plating solutions, alloys
    Mercury (element Hg) 0.1% (1,000 parts per million PPM) Used in some components, batteries, pigments
    Cadmium (element Cd) 0.01% (100 parts per million PPM) Used in batteries, platings
    Polybrominated Biphenyls (PBB) 0.1% (1,000 parts per million PPM) Used as a flame retardant in plastics, insulation
    Polybrominated Diphenyl Ethers (PBDE) 0.1% (1,000 parts per million PPM) Used as a flame retardant in plastics, insulation

    Initial exemptions

    Article 4 Prevention paragraph 2 states: "Paragraph 1 shall not apply to the applications listed in the Annex."[1]

    The Annex states:

    Applications of lead, mercury, cadmium and hexavalent chromium, which are exempted from the requirements of Article 4(1)

    1. Mercury in compact fluorescent lamps not exceeding 5 mg per lamp.
    2. Mercury in straight fluorescent lamps for general purposes not exceeding:
    • halophosphate 10 mg
    • triphosphate with normal lifetime 5 mg
    • triphosphate with long lifetime 8 mg.
    1. Mercury in straight fluorescent lamps for special purposes.
    2. Mercury in other lamps not specifically mentioned in this Annex.
    3. Lead in glass of cathode ray tubes, electronic components and fluorescent tubes.
    4. Lead as an alloying element in steel containing up to 0,35 % lead by weight, aluminium containing up to 0,4 % lead by weight and as a copper alloy containing up to 4 % lead by weight. [sic, using European comma instead of a decimal point]
    5. [sic, no text before the sub-bullets]
    • Lead in high melting temperature type solders (i.e. tin-lead solder alloys containing more than 85 % lead),
    • lead in solders for servers, storage and storage array systems (exemption granted until 2010),
    • lead in solders for network infrastructure equipment for switching, signalling, transmission as well as network management for telecommunication,
    • lead in electronic ceramic parts (e.g. piezoelectronic devices).
    1. Cadmium plating except for applications banned under Directive 91/338/EEC (1) amending Directive 76/769/EEC (2) relating to restrictions on the marketing and use of certain dangerous substances and preparations.
    2. Hexavalent chromium as an anti-corrosion of the carbon steel cooling system in absorption refrigerators.
    3. Within the procedure referred to in Article 7(2), the Commission shall evaluate the applications for:
    • Deca BDE, — mercury in straight fluorescent lamps for special purposes,
    • lead in solders for servers, storage and storage array systems, network infrastructure equipment for switching, signalling, transmission as well as network management for telecommunications (with a view to setting a specific time limit for this exemption), and
    • light bulbs, as a matter of priority in order to establish as soon as possible whether these items are to be amended accordingly[1]

    Commission Decision 2005/747/EC amended the original RoHS Directive on 21 October 2005:

    • 7…lead in solders for servers, storage and storage array systems, network infrastructure equipment for switching, signalling, transmission as well as network management for telecommunications…
    • 15. Lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit Flip Chip packages.

    References

    1. DIRECTIVE 2002/95/EC OF THE EUROPEAN PARLIAMENT AND OF THE COUNCIL of 27 January 2003 on the restriction of the use of certain hazardous substances in electrical and electronic equipment. OJ L 37/19, 13.2.2003.
    2. DIRECTIVE 2011/65/EU OF THE EUROPEAN PARLIAMENT AND OF THE COUNCIL of 8 June 2011 on the restriction of the use of certain hazardous substances in electrical and electronic equipment (recast). OJ L 174/88, 1.7.2011.

    5.2: The Directive is shared under a CC BY 4.0 license and was authored, remixed, and/or curated by LibreTexts.

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